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你可能喜欢正在初始化报价器哪位了解华为交换机hybrid配置是怎样的?dpuserAt_您好，华为、H3C交换机的一种端口模式。和Trunk接口一样在设置允许指定的VLAN通过Hybrid端口之前，该VLAN必须已经存在。
Hybrid端口和Trunk端口在接收数据时，处理思路方法是一样的，唯一区别之处在于发送数据时，Hybrid端口具有解除多VLAN标签的功能，Hybrid端口可以允许多个VLAN的报文发送时不打标签，从而增加了网络的灵活性，在一定程度上也增加了安全性，而Trunk端口只允许缺省VLAN的报文发送时不打标签。
需要注意的是Hybrid端口和Trunk端口不能直接切换，只能先设为Access端口，再设置为其他类型端口。不过，在Quidway S系列交换机以太网端口设置为Trunk类型的相应功能都可以使用Hybrid功能来代替。
希望我的回答对您有所帮助
更多回答huohui华为交换机hybrid配置：
1、PC1、PC2和PC3分别连接到二层交换机SwitchA的端口E0/1 、E0/2和 E0/3，端口分属于VLAN10、20和30，服务器连接到端口G2/1，属于VLAN100。
2、PC1的IP地址为10.1.1.1/24，PC2的IP地址为10.1.1.2/24，PC3的IP地址为10.1.1.3/24，服务器的IP地址为10.1.1.254/24。
rainnintho如果是交换机的话是没有这个设置介面的，直接使用就可以了。 如果是路由器的话，在IE中直接输入192.168.1.1就可以打开设置了，一般如果没有改帐户和密码的都是“admin"。如是不记得密码的话，可以在路由器机身上有个小孔，设置即可。
热门问答123456789101112131415161718192021222324252627282930交换机端口数据类型Access Trunk Hybrid和Tagged Untagged理解笔记
端口数据类型Access Trunk Hybrid和Tagged Untagged理解笔记
一般交换机有多个以太网（物理）端口，每一个端口可根据需要配置，实现不同的功能。而交换机本身有多个VLAN（Virtual LAN 虚拟LAN，一般默认4094个）。VLAN只是虚拟上的划分，物理上的传输需要指定到特定的以太网端口上。
以太网端口有三种链路类型：Access、Hybrid和Trunk。
Access类型的端口只能属于1个VLAN，一般用于连接计算机的端口；
Trunk类型的端口可以属于多个VLAN，可以接收和发送多个VLAN的报文，一般用于交换机之间连接的端口；
Hybrid类型的端口可以属于多个VLAN，可以接收和发送多个VLAN的报文，可以用于交换机之间连接，也可以用于连接用户的计算机。
Hybrid端口和Trunk端口的不同之处在于Hybrid端口可以允许多个VLAN的报文发送时不打标签，而Trunk端口只允许缺省VLAN的报文发送时不打标签
需要注意的是：
1、在一台以太网交换机上，Trunk端口和Hybrid端口不能同时被设置。
2、 如果某端口被指定为镜像端口，则不能再被设置为Trunk端口，反之亦然。缺省情况下，端口为Access端口。
端口接收数据时：
& & &如果端口是tagged方式，当数据包本身不包含VLAN的话，输入的数据包就加上该缺省vlan；如果数据包本身已经包含了VLAN，那么就不再添加。
& & &如果是untagged方式，输入的数据包全部都要加上该缺省vlan。不管输入的数据包是否已经有VLAN标记。
端口发送数据时：
& & &如果端口是tagged方式，如果端口缺省VLAN等于发送的数据包所含的VLAN，那么就会将VLAN标记从发送的数据包中去掉；如果不相等，则数据包将带着VLAN发送出去，实现VLAN的透传。
& & &如果是untagged方式，则不管端口缺省VLAN为多少，是否等于要输出的数据包的VLAN，都会将VLAN ID从数据包中去掉。
tagged一般用了vlan交换机之间的级联，untagged则用于连接PC。
端口的Tagged和Untagged
& & &当我们向一个已经创建的VLAN中添加端口的时候，我们可以指定是否给端口添加标签，如果给端口添加标签我们称为端口是Tagged端口，相反如果我们不给端口添加标签我们就称为该端口为Untagged端口。Tagged端口一般都是中继端口，也就是交换机之间的连接端口。Untagged端口一般都是交换机与终端相连的端口。 &
& & &在BigHammer6800系列交换机上，一个端口可以以Tagged方式属于多个VLAN，但是一个端口只能以Untagged方式属于一个VLAN。From Wikipedia, the free encyclopedia
Hybrid Memory Cube (HMC) is a high-performance
interface for
(TSV)-based stacked DRAM memory competing with the incompatible rival interface
Hybrid Memory Cube was announced by
in 2011 and promises a 15 times speed improvement over . The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including , , , ,
(since withdrawn),
(since withdrawn),
(acquired by Intel in late 2015), and .
HMC combines
to connect multiple (currently 4 to 8)
of memory cell arrays on top of each other. The memory controller is integrated as a separate die.
HMC uses standard DRAM cells but it has more data banks than classic
memory of the same size. The HMC interface is incompatible with current DDRn ( or ) and competing
implementations.
HMC technology won the Best New Technology award from
(publisher of Microprocessor Report magazine) in 2011.
The first public specification, HMC 1.0, was published in April 2013. According to it, the HMC uses 16-lane or 8-lane (half size) full-duplex differential serial links, with each lane having 10, 12.5 or 15 /s . Each HMC package is named a cube, and they can be chained in a network of up to 8 cubes with cube-to-cube links and some cubes using their links as pass-through links. A typical cube package with 4 links has 896 BGA pins and a size of 31×31×3.8 millimeters.
The typical raw
of a single 16-lane link with 10 Gbit/s signalling implies a total bandwidth of all 16 lanes of 40 /s (20 GB/s transmit and 20 GB/s receive); cubes with 4 and 8 links are planned, though the HMC 1.0 spec limits link speed to 10 Gbit/s in the 8-link case. Therefore, a 4-link cube can reach 240
memory bandwidth (120 GB/s each direction using 15 Gbit/s SerDes), while an 8-link cube can reach 320 GB/s bandwidth (160 GB/s each direction using 10 Gbit/s SerDes). Effective memory bandwidth utilization varies from 33% to 50% for smallest packets of 32 and from 45% to 85% for 128 byte packets.
As reported at the HotChips 23 conference in 2011, the first generation of HMC demonstration cubes with four 50 nm DRAM memory dies and one 90 nm logic die with total capacity of 512
and size 27×27 mm had power consumption of 11 W and was powered with 1.2 V.
Engineering samples of second generation HMC memory chips were shipped in September 2013 by Micron. Samples of 2 GB HMC (stack of 4 memory dies, each of 4 Gbit) are packed in a 31×31 mm package and have 4 HMC links. Other samples from 2013 have only two HMC links and a smaller package: 16×19.5 mm.
The second version of the HMC specification was published on 18 November 2014 by HMCC. HMC2 offers a variety of SerDes rates ranging from 12.5 Gbit/s to 30 Gbit/s, yielding an aggregate link bandwidth of 480
(240 GB/s each direction), though promising only a total DRAM bandwidth of 320 GB/sec. A package may have either 2 or 4 links (down from the 4 or 8 in HMC1), and a quarter-width option is added using 4 lanes.
The first processor to use HMCs was the
, which is used in the Fujitsu PRIMEHPC FX100 supercomputer introduced in 2015.
are seen as the mobile computing counterparts to the desktop/server-oriented HMC in that both involve 3D die stacks.
(HBM), developed by
and , used in AMD's , and 's
// Linley group, Jag Bolaria, 12 September 2011
Mearian, Lucas (). . computerworld.com. .
// by Gareth Halfacree, bit-tech, 9 May 2012
Hybrid Memory Cube (HMC), J. Thomas Pawlowski (Micron) // HotChips 23
17 April 2012 at the . by Dave Resnick (Sandia National Laboratories) // 2011 Workshop on Architectures I: Exascale and Beyond, 8 July 2011
// by Gareth Halfacree, bit-tech, 27 January 2012
// The Linley Group, Tom Halfhill, 23 Jan 2012
By Jon Fingas // Engadget, 3 April 2013
HMC 1.0 Specification, Chapter "1 HMC Architecture"
HMC 1.0 Specification, Chapter "5 Chaining"
HMC 1.0 Specification, Chapter "19 Packages for HMC-15G-SR Devices"
(PDF). HMC Consortium. .
Hruska, Joel (25 September 2013). . Extreme Tech 2013.
, 18 November 2014
(PDF). HMC Consortium. .
Halfhill, Tom R. (22 September 2014). "Sparc64 XIfx Uses Memory Cubes". .
Goering, Richard (). . cadence.com. .
, J. Thomas Pawlowski (Micron) // HotChips 23, 2011
by Nicole Hemsoth // HPC Wire, 2 April 2013
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