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& Intel酷睿i3 3225参数
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&类别-发烧/超频，游戏/影音，家用/办公，设计/影像发烧/超频，游戏/影音，设计/影像&Game+游戏装备--骨灰级&品牌-英特尔 Intel英特尔 Intel&系列-酷睿i7，Extreme至尊系列酷睿i7，Skylake&类型-cpuCPU&CPU适用类型台式机--&CPU名称Intel 酷睿i3 3225i7-7740Xi7-6700K&核心类型Ivy Bridge酷睿i7 X系列Skylake&接口类型LGA 1155LGA 2066LGA 1151&CPU核心双核四线程四核四核&CPU针脚数目1155Pin--&制程工艺22纳米--&技术参数
&CPU频率3.3GHz--&处理器倍频33倍--&CPU支持指令集x86，x86-64，MMX，SSE,SSE2，SSE3，SSSE3，SSE4.1，SSE4.2，AVXSSE4.1/4.2, AVX 2.0SSE 4.1/4.2, AVX 2.0&64位处理器-是是&特性-内存类型 DDR4-2666内存类型 ，最高DDR3L-1600/DDR4-2133；核芯显卡HD Graphics 530&处理器缓存
&二级缓存容量256KB--&三级缓存容量3MB8 MB L38M&显卡参数
&集成显卡Intel HD Graphics 4000--&物理参数
&工作功率55W--&
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求鉴定更多吧内有用I3 3225这款处理器的朋友么？_图拉丁吧_百度贴吧
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吧内有用I3 3225这款处理器的朋友么？收藏
这两天在折腾以前配的一台迷你机器 用的I3 3220T的核显 HD 2500WINDOWS 7评分里图形两项是5.7和6.3 不知道堂兄3225或者3245的HD 4000有没有可能达到两项7.0以上？想搞一串五个7分以上.倒是见过HD 4000在笔记本上两项达到7.0分的 不过可能是I7的处理器。
或者至少6.5 ， 5.7像是57分不及格
内存是芝奇的DDR3
谢啦 有用3225或者3245的帮忙测一下喽
天猫开学福利特惠,图拉丁处理器,百元大额券限时疯抢,低至12期免息,优惠享不停!新学期,新装备,2018年开学爆到,天猫让你嗨翻购!
算了 自己入一枚测下
登录百度帐号推荐应用Intel® Core(TM) i3-3225 Processor (3M Cache, 3.30 GHz) Product Specifications
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Specifications
Product Collection
Vertical Segment
Processor Number
Discontinued
3 MB SmartCache
5 GT/s DMI
Intel(R) HD Graphics 4000
# of Displays Supported ?
up to 1x16, 2x8, 1x8 & 2x4
Max CPU Configuration
Package Size
37.5mm x 37.5mm
Low Halogen Options Available
Intel(R) SSE4.1, Intel(R) SSE4.2, Intel(R) AVX
Compatible Products
Product Name
PCI Express Revision
USB Revision
Embedded Options Available
Recommended Customer Price
Product Name
PCI Express Revision
USB Revision
Embedded Options Available
Recommended Customer Price
Product Name
Chassis Form Factor
Board Form Factor
Discontinued
Discontinued
Discontinued
Product Name
Chassis Form Factor
Board Form Factor
Discontinued
4U Pedestal
Discontinued
4U Pedestal
Discontinued
4U Pedestal
Product Name
Board Form Factor
Chassis Form Factor
Embedded Options Available
Discontinued
Rack or Pedestal
Discontinued
Rack or Pedestal
Ordering and Compliance
Ordering Code
Ordering Code
Ordering Code
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Recommended Customer Price
Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close.
The processor base frequency is the operating point where TDP is defined.
Frequency is measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor.
Intel(R) Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and m direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’ and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report.
See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel(R) processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported
ECC Memory Supported indicates processor support for Error-Correcting Code memory.
ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics ?
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel(R) HD Graphics, Iris(TM) Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the
page for more information.
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel(R) HD Graphics with Dynamic Frequency feature.
Intel(R) Quick Sync Video
Intel(R) Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel(R) InTru(TM) 3D Technology
Intel(R) InTru(TM) 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.
Intel(R) Flexible Display Interface (Intel(R) FDI)
The Intel(R) Flexible Display Interface is an innovative path for two independently controlled channels of integrated graphics to be displayed.
Intel(R) Clear Video HD Technology
Intel(R) Clear Video HD Technology, like its predecessor, Intel(R) Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel(R) Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
PCI Express Revision
PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer.
The different PCI Express versions support
different data rates.
PCI Express Configurations ?
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.
Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).
Intel(R) Turbo Boost Technology ?
Intel(R) Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel(R) vPro(TM) Technology ?
Intel(R) vPro(TM) Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security:
1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel(R) Hyper-Threading Technology ?
Intel(R) Hyper-Threading Technology (Intel(R) HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel(R) Virtualization Technology (VT-x) ?
Intel(R) Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel(R) Virtualization Technology for Directed I/O (VT-d) ?
Intel(R) Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium(R) processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel(R) VT-x with Extended Page Tables (EPT) ?
Intel(R) VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel(R) Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel(R) 64 ?
Intel(R) 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.? Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects.
These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Intel(R) My WiFi Technology
Intel(R) My WiFi Technology enables wireless connection of an UltrabookTM or laptop to WiFi-enabled devices such as printers, stereos, etc.
Idle States
Idle States (C-states) are used to save power when the processor is idle.
C0 is the operational state, meaning that the CPU is doing useful work.
C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep(R) Technology
Enhanced Intel SpeedStep(R) Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep(R) Technology switches both voltage and frequency in tandem between high and low levels in response to processor load.
Enhanced Intel SpeedStep(R) Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features.
An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel(R) Identity Protection Technology ?
Intel(R) Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel(R) IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions,
providing verification that it is not malware attempting to login. Intel(R) IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel(R) AES New Instructions
Intel(R) AES New Instructions (Intel(R) AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Secure Key
Intel(R) Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
Intel(R) Trusted Execution Technology ?
Intel(R) Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel(R) processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ?
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Anti-Theft Technology
Intel(R) Anti-Theft Technology (Intel(R) AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen.
Intel(R) AT requires a service subscription from an Intel(R) AT–enabled service provider.
Pre Active: Orders may be taken, but not scheduled, nor shipped.
Active: This specific part is active.
End of Life: Product End of Life notification has been published.
Quality/Reliability Hold.
Reschedule
Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.
Retired: This specific part is no longer being manufactured or purchased and no inventory is available.
No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.
Obsolete: Inventory available. No future supplies will be available.
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Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.
The information herein is provided &as-is& and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M.
Please contact OEM for the BIOS that includes the latest Processor configuration update.
? This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries.
Intel processors manufactured before January 1, 2013 are not confirmed conflict free.
The conflict free designation refers only to product manufactured after that date.
For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
for more information including details on which processors support Intel(R) HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel(R) Turbo Boost Technology.
for more information.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products.
Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP
does not constitute a formal pricing offer from Intel.
Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios.
Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen:
Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product.
Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC
requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see .
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
for details.
Processors that support 64-bit computing on Intel(R) architecture require an Intel 64 architecture-enabled BIOS.
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